产品与技术
PRODUCTS AND TECHNOLOGY
MANUFACTURING
珠海中京制造能力
| HDI项目 | 2022 | 2023 | 2024 | 2025 |
| 叠构 | 1+N+1，2+N+2,3+N+3,4+N+4,Any layer | |||
| 板厚 | 0.30-2.40mm | |||
| 线宽/线距 | 0.040/0.040mm（Subtractive） | 0.035/0.035mm（Subtractive） | 0.030/0.030mm(mSAP) | 0.025/0.025mm(amSAP) |
| 最小芯板厚 | 0.050mm | 0.040mm | Coreless | |
| 最小介层厚 | 0.035mm | 0.030mm | 0.020mm | |
| 最小钻头 | 0.150mm | 0.100mm | ||
| 镭射孔径 | 0.075mm | 0.065mm | 0.050mm | |
| PTH纵横比 | 8:1 | 10:1 | ||
| 盲孔纵横比 | 1:1 | |||
| 填孔凹陷度 | 0.010mm | 0.005mm | ||
| 镭射底PAD对准度 | 0.050mm | 0.040mm | 0.030mm | 0.025mm |
| 防焊开窗对准度 | 0.025mm | 0.020mm | 0.015mm | |
| 最小锡球Pitch | 0.35mm | 0.32mm | 0.30mm | |
| 防焊开窗 | 0.150mm | 0.125mm | 0.100mm | 0.080mm |
| 阻抗公差 | +/-10% | +/-8% | +/-7% | |
| 表面处理 | OSP、ENIG、OSP+ENIG | |||
