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中京元盛制造能力
项目 | 2022 | 2023 | 2024 | 2025 | |
总层数 | 6 | 8 | 10 | 12 | |
挠性板层数 | 4 | 6 | 8 | 8 | |
HDI阶数 | 1阶 | 2阶 | 2阶 | 2阶 | |
铜厚(um) | 挠性内层 | 18 | 12 | 12 | 9 |
挠性外层 | 18 | 12 | 12 | 9 | |
线宽/间距(mil) | 挠性内层 | 2.0/2.0(12um) | 1.5/1.5(12um) | 1.5/1.5(12um) | 1.2/1.2(9um) |
挠性外层 | 2.5/2.5(15-18um) | 2.0/2.0(10-15um) | 2.0/2.0(10-15um) | 1.8/1.8(9-15um) | |
手指宽度≤50um公差 | ±0.02mm | ±0.015mm | ±0.015mm | ±0.013mm | |
Bonding金手指Pitch公差 (Total pitch≤45mm) | ±0.03mm | ±0.025mm | ±0.025mm | ±0.020mm | |
最小机械孔直径(um) | 100 | 75 | 75 | 75 | |
镭射孔直径(um) | 75 | 75 | 50 | 50 | |
Dimple管控 | ≤15um | ≤10um | ≤10um | ≤10um | |
金属化孔壁到内层线间距(mm) | 0.25 | 0.175 | 0.175 | 0.175 | |
NPTH孔壁到内层线间距(mm) | 0.175 | 0.125 | 0.125 | 0.125 | |
过孔孔壁到刚挠板边缘的距离(mm) | 塞孔 | 0.6 | 0.45 | 0.45 | 0.45 |
不塞孔 | 0.5 | 0.4 | 0.4 | 0.4 | |
刚柔结合处过渡区控制(mm) | 1.2 | 0.8 | 0.8 | 0.6 | |
刚柔结合处溢胶控制(mm) | 0.3 | 0.25 | 0.25 | 0.2 |
